The Intel announced today (06) the release of a new module for notebooks that combines a Core-I CPU the eighth generation a dedicated GPU Radeon ROM and a memory package standard RAM HBM2 (comparable to GDDR5) in one plate. The biggest highlight of this module is its small size, which may give rise to thinner and light notebooks, but the most striking thing here is the partnership between Intel and AMD rivals.
New module was developed for consumers who like to have powerful hardware to play or perform content creation tasks
The last time the two collaborated on any project publicly was in the 1980s, and since then, both have been digging into the market for chips for desktops and notebooks. While Intel had more success in the field of CPUs, AMD specialized in GPUs. Intel claims that this new module is designed for enthusiastic consumers who like to have powerful hardware to play or perform content creation tasks. The advantage is that, with this, it would be possible to obtain good computational and graphical processing power in smaller and lighter machines.
Manufacturers could use this module to save space or simply take advantage to include new components within their products, such as more efficient cooling systems, more battery life or even modems for 4G connectivity.
This integration of several components in a single module, according to Intel, was only possible thanks to the Embedded Multi-Die Interconnect Bridge (EMIB), a bridge for connecting different chips that allows high data transfer at small distances.
The creator of this novelty explains that the first device that will have this new module will be released in the market for the final consumer in the first quarter of 2018, but we do not know if the company speaks of Dell, HP, Lenovo, Microsoft, Apple or any other manufacturer of notebooks.
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